Accelerated Machine Learning Antenna Synthesis Through Binary Metal-Vacuum Mesh Activation and Data Reuse in a MoM Framework
Abstract: We propose a novel approach to efficiently generate large datasets for antenna synthesis by addressing challenges in handling arbitrary geometrical configurations. In 30 minutes, a dataset of 3,000,000 antennas, covering a frequency range from 0.1 to 5 GHz, was generated, significantly accelerating the design process through machine learning. This was achieved by adding/removing triangular metal patches inside the antenna mesh domain through efficient manipulation of the rows and columns of a pre-calculated Method-of-Moment (MoM) matrix. Such flexibility in efficiently simulating new designs by reusing precomputed data is not available in commercial electromagnetic (EM) solvers. The generated dataset of antenna meshes is used to train a convolutional neural network (CNN). After training, the CNN accurately predicts the input impedance for arbitrary input meshes, without using an EM solver. The CNN was integrated into a genetic optimization algorithm, allowing antenna optimization in minutes instead of hours, with a mean squared error 0.0026.
Keywords: Antenna synthesis, optimization algorithms, Method of Moments, Machine Learning, convolutional neural network
Published in: EuCAP 2025
Date of Publication: 30 Mar – 4 Apr 2025
Analysis of Millimeter-Wave Array Frontend Architectures for High EIRP: Comparing Various Beamforming and Power Combining Techniques
Abstract: This paper analyzes various beamforming array antenna frontend architectures for future 6G communication systems, focusing on enabling high-data-rate global connectivity over long distances. The analysis is centered on the use of upper millimeter-wave frequency bands, specifically between 75 and 110 GHz, to achieve the targeted performance. Key challenges include efficient millimeter-wave RF power generation in the array transmitter and accurate beam steering and tracking through antenna design. We build on state-of-the-art research to compare different beamforming array designs, including: (i) conventional active phased arrays with full beamforming control and on-element power combining, (ii) switched beam modular arrays with spatial power combining, and (iii) architectures that integrate joint power combining and beamforming through quasi-optical networks. To support our analysis, we use simplified models of array transmitters, incorporating literature data and based on our design experience with commercial (PIN-)pHEMT (Al)GaAs processes. To illustrate these concepts, we present a case study of a 50 dBi reflector antenna fed by a phased-array feed designed for W-band backhaul links. The design curves obtained from our analysis show the effective isotropic radiated power (EIRP) of the frontend as a function of the number of combined PAs in different array architectures, providing insights into the trade-offs involved in achieving optimal performance with minimal energy consumption.
Keywords: Phased array, active antenna, millimeter wave, transmitter, quasi-optics, focal plane array.
Published in: EuCAP 2025
Date of Publication: 30 Mar – 4 Apr 2025
Dual-Polarized Dielectric Resonator Antennas with Air-Gap-Free Metasurface Loading for LTCC-based 5G-and-Beyond Antenna-in-Package Phased Arrays
Abstract: This work introduces a dual-polarized (DP) dielectric resonator antenna (DRA) phased array designed for 5G and beyond AiP solutions using low-temperature co-fired ceramic (LTCC) technology. The primary challenge is maximizing a twodimensional (2-D) beamsteering range with a compact form factor in a DP operation. Most reported DP LTCC AiP arrays have ≤ 55◦ beamsteering range at 5G mmWave frequencies and lack experimental validation for DP 2-D beamsteering operation. In contrast, the proposed antenna element in the infinite array environment enables }60◦ 2-D beamsteering in the 5G n261 (27.5-28.35 GHz) band with the antenna element form factor as small as 5mm×5mm×1.3mm. This performance is achieved by introducing a wide-angle impedance matching (WAIM) structure directly at the DRA aperture that includes a dual-layer metasurface, formed by periodically arranged electrically small patches in a staggered configuration. The proposed DRA with WAIM metasurface are manufactured in a single LTCC process without any air gaps in between. An 8×8 DP AiP array prototype is implemented on a printed circuit board carrier using 4×4 subarrays, containing 2×2 DRAs and packaged with ball grid arrays to facilitate integration. This modular approach allows scaling to large array configurations while considering the critical effects of the package stack-up and DP feeding topology. The simulated active reflection coefficient is < −8.5 dB within }60◦(with a scan loss marginally above 3 dB) at 27.5-29.5 GHz. Measurements confirm simulations for all relevant performance metrics within }60◦ 2D-range, establishing this comprehensive demonstration as a novel contribution of our work.
Keywords: Phased Array, Antenna-in-Package, Low-Temperature Co-Fired Ceramic, Metasurface.
Published in: EuCAP 2025
Date of Publication: 30 Mar – 4 Apr 2025
Measurement of Reconfigurable Intelligent Surfaces Through the Back-Scattering Method: Demonstration at 28 GHz
Abstract: This paper introduces a parameter extraction tech-nique for characterizing and validating the performance of a Reconfigurable Intelligent Surface (RIS) unit cells (UCs) using an over-the-air back-scattering approach. This technique addresses the challenge of characterizing RIS UCs when physical access to ports is not available. Experiments were conducted at 28 GHz with a prototype featuring two RIS UCs. The results demonstrate that the UC port relfection coefficient as seen from the load termination can be estimated by measuring the back-scattered field from the RIS. The accuracy of the estimation depends on the precision of the equivalent circuit models used for the reconfigurable PIN and varactor diodes employed as variable load terminations in the UCs. This method offers a practical solution for characterizing RIS UCs that may have highly inte- grated components so that over-the-air characterization becomes a necessity.
Keywords: Reconfigurable intelligent surface, backscatter-ing method, antenna measurement, over-the-air testing
Published in: EuCAP 2025
Date of Publication: Nov 2024
Assessment of Different Scenarios on Input Impedance of a Thin Wire
Abstract: This paper assesses effects of distinct scenarios on the measurement of the input impedance of cables connecting two devices. The test setup comprises two vertical reference planes and a horizontal reference plane parallel to which a thin wire is placed. The wire is soldered to SMA connectors on both sides, and these connectors are attached to the vertical reference planes. The wire is also connected to a measurement device on one side and linked to DUTs on the other side. The DUTs represent three extreme cases: open, short, and load terminations. Other possible scenarios fall approximately between these extremes. For each DUT, a measurement is conducted, and a comparison is made. The results reveal that changes in the input impedance are not solely due to the wire; rather, terminations and the reference planes of the devices also significantly impact the behavior of the input impedance.
Keywords: Cable, Common-mode, EMC, EMI, Input impedance, Interconnecting cables, Wire
Published in: EMC Europe conference, Bruges, Belgium, 2-5
Date of Publication: Sep, 2024
Recent Advances in Full-Wave Modelling of IC Packaging
Abstract: Recent Advances in Full-Wave Modelling of IC Packaging
Keywords: Modelling, IC Packaging
Published in: NEMO 2024
Date of Publication: Aug 12, 2024
Comparison of circuit models for ML-assisted design of microwave circuits
Abstract: Machine-learning (ML) assisted microwave circuit design is an interesting complement to traditional topology-based design since it opens up previously unexplored design spaces that in some cases may offer better performance, or similar performance with a different form factor. A key part of this topic is the circuit model, i.e., the set of discrete building blocks used to create circuits. In previous work on ML-assisted microwave circuits, circuit models encompassed a single element type in the form of square-shaped metal pieces, and to facilitate diagonal connections the elements are enlarged with respect to the grid onto which they are placed. Here, we propose a circuit model with additional elements with the aim to improve diagonal connections, and a performance comparison is made with different enlargements relative to the grid for circuit models with square-shaped elements. The results show that the proposed model results in more accurate ML-models for S-parameter prediction, leading to more accurate results for circuit synthetization. In addition, circuits built with the proposed model show a small improvement of transmitted power at higher frequencies compared to existing models. It is also shown that for the models utilizing only squareshaped elements, more accurate ML-models are obtained for larger expansions of the circuit elements relative to the grid.
We also demonstrate that the considered circuit models, Mlmodels trained to predict |S21| and genetic optimization can be used to design lowpass filters with competitive performance. The best filter has a maximum insertion loss of 0.60 dB below 6 GHz, and stop-band rejection higher than 40 dB at 8-10 GHz.
Keywords: electronic circuits, surrogate model, machine learning, genetic algorithm
Published in: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Date of Publication: Aug. 2024
Antenna Array Measurements by a Scalable Backscatter Modulation Procedure
Abstract: We introduce a novel measurement approach for characterizing antenna arrays based on the backscattering modulation method. Systematic retrieval of antenna parameters is achieved via a scalable S -parameter re-normalization procedure. In addition, the frequently overlooked sign ambiguity in phase retrieval of coupling S -parameters is addressed. Numerical results for a four and eight-element dipole array demonstrate the effectiveness in extracting the S -parameters and gain patterns using only three switchable load terminations per antenna element.
Keywords: Antenna arrays, Antenna measurements, Scattering parameters, Dipole antennas, Gain measurement, Frequency measurement, Reflection coefficient
Published in: IEEE Antennas and Wireless Propagation Letters ( Volume: 23, Issue: 10, October 2024)
Date of Publication: Jun 2024
[Poster] Modeling Active Phased Arrays with High Power Amplifiers: Optimizing system-level performance through co-design
Keywords: Active Phased Arrays, High-Power RF Amplifiers, System-Level Optimization
Published in: 2024 Benelux RF conference in Nijmegen
Date of Publication: May 2024
Advances on packaging for mmWave components
Abstract: CITC (Chip Integration technology Center) is a research institute focusing on technology development for advanced packaging and heterogeneous integration. During this talk, CITC latest technology developments for mmWave packaging will be addressed. These technology developments enable a higher degree of integration and improved heat dissipation. In particular, novel packaging methods, based on fan-out technologies and additive manufacturing, offer new possibilities for the in-package integration of RF elements such as antennae and shielding. Furthermore, high-thermal conductivity substrates (e.g. diamond heat spreaders) and high-performance die attach materials can improve the package heat dissipation, leading to improved performance of high-power RF components such as power amplifiers.
Published in: Benelux conference 2024
Date of Publication: May 29, 2024
VNA-Based Total Radiated Power Measurements in Reverberation Chambers
Abstract: This paper introduces a novel method for total radiated power (TRP) measurements in reverberation chambers, utilizing the capabilities of a Vector Network Analyzer (VNA) without the need for a spectrum analyzer and signal generator. In contrast to conventional methods, this VNA-based approach offers a fast, simplified and efficient alternative for TRP testing in uncalibrated electromagnetic reverberation chambers (RCs).
Keywords: TRP measurements, reverberation chambers, VNA
Published in: EMC Europe
Date of Publication: Apr 2024
Antenna Characterization by the Back-Scattering Measurement Method Using the Integrated RF-Frontend as Load Modulation Device
Abstract: We demonstrate the feasibility of characterizing an antenna over-the-air by measuring its back-scattered field while modulating this field using the integrated RF-frontend which acts as a variable antenna load. This eliminates the requirement for implementing dedicated load switching circuitry commonly utilized for this purpose. Numerical results are presented for a 100 GHz on-chip antenna and for two example frontends: (i) a Tx frontend employing only a power amplifier, and; (ii) a transceiver frontend employing a Tx/Rx switch, a power amplifier and a low-noise amplifier. Using the proposed procedure with both frontends, the input reflection coefficient of the Device Under Test is recovered with a relative numerical error of less than 10−11. Also, the procedure for estimating the realized gain demonstrates a relative error of less than 5%, primarily attributed to the accuracy of the electromagnetic simulation model. Furthermore, the impact of measurement uncertainties is analyzed.
Keywords: Antenna measurements, antenna characteriza-tion, back-scattering modulation method
Published in: ICEAA 2024
Date of Publication: Apr 2024
Exploring the Properties of Reverberation Chambers in the THz Range: A Pilot Study
Abstract: The rapid evolution of wireless communication technology and the emergence of 6G have led to the exploration of new segments of the electromagnetic spectrum, specifically the THz region. These high frequencies promise exceptionally high data rates, yet they also introduce substantial technical challenges. One primary challenge involves measurement techniques, encompassing component design, instrument manufacturing, and the creation of practical testing environments suitable for these frequencies. In this paper, we focus on employing reverberation chambers as testing environments within the THz region. Firstly, we examine the chamber’s characteristics, particularly addressing losses up to 220 GHz. Subsequently, we present the hardware components and introduce a dedicated new mode stirrer designed for operation at these frequencies. The paper also offers insights and establishes a theoretical foundation for loss calculations within the reverberation chamber at high frequencies.
Keywords: Reverberation Chamber, Terahertz (THz) Frequencies, Spurious Emission, 5G, 6G, OTA
Published in: European Conference on Antennas and Propagation EuCAP2024, Glasgow, UK EuCAP2024
Date of Publication: Mar 2024
The Estimation of Cable Input Impedance Through Analytical Techniques
Abstract: In this paper, two analytical techniques for computing the input impedance of cables are introduced. Given the pivotal role of the SMA connector in altering cable input impedance, it is essential to account for the significant effect of the connector in the impedance calculations. This effect is addressed through the use of two models for the connector, namely the circuit model and the cascade model. These analytical techniques can be applied to various cables, provided that the impedance of the cable up to the connector is known, and the impact of the connector on the input impedance is appropriately considered by the models.
Keywords: Cable, Common-mode, EMC, EMI, Input impedance, circuit model
Published in: EMC Japan/Asia-Pasific International Symposium on Electromagnetic Compatibility
Date of Publication: Jan 2024
A W-band Quasi-Optical Array Antenna Feeding Network with High Taper Efficiency Using Optimal Ridge Excitation of an H-Plane Sectoral Waveguide
Abstract: A novel H-plane quasi-optical (QO) feeding network for linear (sub-)array gap waveguide (GWG) antennas intended for beam-steering applications at W-band is presented. The QO feed comprises an H-plane sectoral GWG excited by an input stepped ridge gap waveguide (RGW) and transitioned to an overmoded rectangular groove gap waveguide (GGW) section, the latter being terminated with an array of RGW output probes. This work’s key challenge and novelty is engineering the desired modal content in the QO structure for uniform amplitude excitation of array elements to enhance antenna gain with a low insertion loss. This was addressed by (i) realizing an optimal multi-mode excitation of the sectoral GWG and (ii) a proper phasing of a rich modal spectrum of the output overmoded GGW. An eigenmode-based semi-analytic approach was developed to investigate the impact of an input ridge length on the excited modal content and was shown to predict optimal results close to full-wave simulations. The demonstrated QO feed concept, applied to a 20-element array design, significantly outperforms existing solutions by achieving a 97% amplitude taper efficiency and showing less than 0.4 dB insertion loss over a 21% relative bandwidth (85–105 GHz).
Keywords:—quasi-optical feed, array antenna, gap waveguide
Published in: IEEE Antennas and Wireless Propagation Letters
Date of Publication: Dec. 2023
A Compact and Wideband MMIC to Ridge Gap Waveguide Contactless Transition for Phased Array Antenna Front-Ends
Abstract: A concept of a contactless in-line transition between a monolithic microwave integrated circuit (MMIC) and a ridge gap waveguide (RGW) is proposed and investigated at W-band. The transition employs an E-plane waveguide bifurcation obtained by mounting a GaAs MMIC on a supporting PCB in the opening of an RGW top metal lid. Designed this way, multiple contactless transitions can be placed in a row with an electrically small spacing that makes the transition idea suitable for array antenna front-ends. A transition equivalent circuit is constructed employing a single-mode transmission line model, which is verified through a full-wave simulation. An (85–105) GHz transition design is then developed and experimentally investigated in the back-to-back configuration indicating a (0.5–0.75) dB transition insertion loss. Finally, the performance of a 1-bit phase shifter MMIC, integrated into the RGW using two proposed transitions, is demonstrated.
Keywords:Contactless transition, MMIC, gap waveguide, array antennas
Published in: IEEE Antennas and Wireless Propagation Letters
Date of Publication: Dec 2023
Wideband Reflection-Type p-i-n Diode Phase Shifters in GaAs MMIC Technology at W-Band
Abstract: In this paper, we report on developing W-band GaAs p−i−n diode phase shifters (PSs) with a wideband phase and amplitude response. The PSs employ the reflection-type architecture with reflective loads providing discrete phase tunability through diode dc control. We address the design challenge of having a stable phase shift and a minimal insertion loss imbalance for the diodes with a relatively low commutation quality factor at high millimeter-wave frequencies. Two PS examples, namely 180- and 90-degree bits, are designed for the targeted (85-105) GHz operating band. The circuits were fabricated in the commercial PIN-pHEMT GaAs process with 8×8μm2p−i−n diodes. Both simulated and measured results are in good agreement demonstrating wideband frequency performance.
Keywords: Time-frequency analysis, Correlation, Statistical analysis, Reverberation chambers, Loading, Estimation, Europe
Published in: 2023 18th European Microwave Integrated Circuits Conference (EuMIC)
Date of Publication: Oct 2023
A Multivariate Approach for the Effective Sample Size of Frequency Stirring
Abstract: We introduce a new method for the estimation of the effective sample size due to frequency stirring in reverberation chambers. The method is based on a multivariate approach, which is able to estimate the single-level correlation of frequency stirring, based on two-, or many-levels correlations due to concurrent stirring mechanisms. We confront the estimations of the effective sample size due to frequency stirring from our method with theoretical predictions. The comparison with theory, shown here for the first time, allows for a deeper confidence on the validity of our proposed method. The agreement is shown for different types of reverberation chambers, at different loading conditions for wide frequency ranges.
Keywords: Time-frequency analysis, Correlation, Statistical analysis, Reverberation chambers, Loading, Estimation, Europe
Published in: 2023 International Symposium on Electromagnetic Compatibility – EMC Europe
Date of Publication: Oct 2023
On the Relation Between Field Correlation and Field Uniformity in Reverberation Chambers
Abstract: Analytical formulas and Monte Carlo simulations are here offered in order to investigate if, and up to which extent, residual correlation of measured electric field (E-field) magnitude affects or influences field uniformity in a reverberation chamber (RC). Field uniformity is evaluated according to the standard IEC 61000-4-21 [1]. It is shown that correlation associated with mechanical stirrer worsens field uniformity, while spatial correlation and correlation between orthogonal E-field components may improve (i. e., reduce the numbers quantifying) field uniformity.
Keywords: Correlation, Monte Carlo methods, Reverberation chambers, Electric variables measurement, IEC Standards, Electric fields, Standards
Published in: 2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS)
Date of Publication: Oct 2023
Analysis of Concurrent and Correlated Stirring Mechanisms in Reverberation Chambers
Abstract: A new multivariate statistical analysis is proposed to derive the estimates of effective sample sizes of reverberation chamber (RC) measurement data. Concurrent correlation effects, related to different and simultaneously acting stirring mechanisms, are taken into account and individually quantified. The mean and variance of correlated measurement data are also estimated, as well as the variance of the grand mean. The analysis is independent on the parent probability distributions. Formulae are obtained through a step-by-step derivation, stemming from basic statistical principles and general assumptions, which are deemed to be applicable to the correlation structures of RC measurement data. Experiments and comparison with closed-form predictions confirm the validity and generality of the analysis.
Keywords:Measurement uncertainty, Size measurement, Frequency measurement, Autocorrelation, Standards, Probability density function, Volume measurement
Published in: IEEE Transactions on Electromagnetic Compatibility
Date of Publication: Apr 2023
Uncertainties in determining the gain-curves of a Standard Gain Horn Antenna from 90 GHz to 140 GHz
Abstract: This paper examines the validity of employing the Naval Research Laboratory’s (NRL) on-axis gain calibration curves as a standard reference, as specified in the commercial Standard Gain Horn (SGH) antenna datasheets, for the frequency range of 90 GHz to 140 GHz for antenna gain measurements. We present a comprehensive analysis of the on-axis gain calibration curve characteristics and the dimensions of the SGH antenna by employing three different dimensional measurement techniques and quantifying the discrepancies in comparison to the on-axis calibration curve found in datasheets. Additionally, we demonstrate that inaccuracies in the dimensional data provided in the commercial SGH
antenna datasheet can lead to a gain deviation of ±1 dB from the anticipated gain. We validate the on-axis gain curves obtained from simulation by conducting measurements in a spherical anechoic chamber
Keywords: Anechoic chamber, measurements, mm-wave, on-axis gain curve, Standard Gain Horn (SGH)
Conference: The 18th European Conference on Antennas
and Propagation will be held on March 17-22 March 2024, in Glasgow, Scotland
Date of Publication: Dec 2023
Efficient Integral-Equation Methodology for Full-Wave
Signal Integrity Analysis on the IBM Plasma Substrate Benchmark
Abstract: A full-wave simulation is conducted on the IEEE plasma package benchmark problem using an integral equation-based solver. This approach offers two distinct advantages over conventional Finite-Element Method (FEM) based solvers, namely the use of a surface-based mesh instead of a volumetric representation and excellent efficiency for largescale structures such as IC packages. With its large quantity of geometries, the benchmark serves as a test case for validating the performance of full wave solvers on integrated circuits
Keywords: Packaging Benchmark Suite, Integral Equation Solver, Integrated Circuit (IC)
Conference: IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) December 12-14, 2023
Date of Publication: Sept 2023
Contactless measurement of a D-band on-chip antenna
using an integrated reflective load switch
Abstract: A novel measurement setup is proposed for the contactless characterization of on-chip antennas. A D-band patch antenna is fabricated on a 100 μm-thick GaAs substrate and is monolithically integrated with a reflective load switch to allow for fast electronic control of the antenna port termination. The antenna under test is illuminated by a reference antenna in the anechoic chamber after which the impedance and gain of the patch antenna are reconstructed from the change in backscat- tered field due to different port terminations. In our experiment, the over-the-air reconstructed antenna input impedance exhibits a frequency shift of less than 1% with respect to the (non-ideal) on-wafer probe measurement in the 115–130 GHz frequency range. Furthermore, the measured realized gain of 0.9 ± 0.5 dBi is close to the simulated one of 1.1 dBi.
Keywords: quasi-optical feed, array antenna, gap
waveguide
Published in: IEEE Antennas and Wireless Propagation Letters
Date of Publication: Sept 2023
Integral Equation-Based Solver for the Simulation of
Integrated Circuit Packages
Abstract: A full wave simulation using an integral equation based solver on the IEEE plasma package benchmark problem is performed. The integral equation approach offers advantages over traditional Finite-Element Method (FEM) solvers, as it uses a surface-based mesh and shows excellent efficiency for large-scale structures like IC packages. With its large amount of geometries, The benchmark is used as a test case to validate the full wave solvers on integrated circuits.
Keywords: Packaging Benchmark Suite, Integral Equation Solver, Integrated Circuit (IC)
Conference: 2023 EPEPS Conference
Date of Publication: Sept 2023
Scan-Loss Compensation for Full-Azimuth Multi-Facet Phased
Array Antennas
Abstract: An approach to compensate scan losses displayed by full-azimuth multifacet phased arrays is proposed in this article. This approach is based on a constructive superposition of scanned beams from adjacent array panels resulting in enhanced composed coverage. Said constructive superposition is achieved by coordinating the insertion phase shifts applied at the array element level. Special attention is given to panel arrays arranged in equilateral triangle and square prisms. The benefits of the proposed beamforming approach are validated by full-wave simulations, as well as passive antenna measurements taken on physical prototypes. The achieved improvement in equivalent isotropically radiated power (EIRP) excessively compensates for the experienced scan loss and reaches 6 dB at the maximal scan angles. An additional advantage of the developed methodology consists in the mitigation of the composed beam squint at wide scan angles.
Keywords: Equivalent isotropically radiated power (EIRP), far-field superposition,
full-azimuth phased arrays, scan loss
Published in: IEEE Transactions on Antennas and Propagation
Date of Publication: Dec 2022
Automated Creation of Reusable Generators for Analog IC Design with the Intelligent IP Method
Abstract: Procedural generators are often proposed for analog IC design automation. They promise to encapsulate designer knowledge and intellectual property (IP) data in a deterministic and reusable way. While recent developments claim to have proven this, one question remains: How to create generators efficiently and integrate them in an automated design flow? A major challenge for generators is the trade-off between initial implementation effort, reusability, and acceptance. This raises further questions on the role of the generator supplier: Who should spend the effort implementing and maintaining generator IP? Which interfaces and standards can be used to implement and integrate them into common design environments? In order to address these challenges, we propose a combination of pre-defined generators for basic building
blocks at lower hierarchy levels with automatic creation of generators using place and route templates for more complex circuits. The paper demonstrates the successful application of this flow to an OTA design and discusses the required implementation efforts, quality of the generated results and potential future developments.
Keywords: analog; layout; generators; templates; design
automation; reuse; soft IP
Conference: DVCon Europe 2022 (dvcon-europe.org)
Date of Publication: Dec 2022
- 2025
- 2024
- Xecs Matchmaking Event – Xecs Call 4 Hamburg Oct 15 2024 (InnoStar Poster)
- ICEAA – IEEE APWC Sep 2 – 6, 2024 (Chalmers)
- EMC Europe conference, Bruges, Belgium Sep 2 – 5, 2024 (TU/e)
- IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems society information Aug, 2024 (Ericsson)
- Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO’2024) Aug. 12 – 14 , 2024, Montreal, Canada. (CEMWorks)
- Eureka Global Innovation Summit İstanbul, Türkiye 13-14 June 2024 (InnoStar Poster)
- Benelux RF Conference May 29, 2024 (IMST / CITC)
- IEEE Asia-Pacific EMC Symposium (APEMC) (APEMC) May 20 – 24, 2024 (TU/e)
- European Conference on Antennas and Propagation (EuCAP) Mar 17 – 22, 2024 (Chalmers / TU/e / Bluetest / Ericsson)
- PENTA INNOSTAR – M24 – PENTA-Review – Munich 2024 Feb 14 – 15 (All Partners)
- IEEE Silicon Monolithic Integrated Circuits in RF Systems (SiRF) Jan 21 – 24, 2024 (Infineon)
- 2023
- Samsung Foundry Forum, EMEA Nov 2 to Dec 31, 2023 (MunEDA / IMST / Fraunhofer IIS/EAS)
- Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Oct 15 & 18, 2023 (CEMWorks)
- URSI General Assembly and Scientific Symposium (URSI GASS 2023) Aug 19 – 26, 2023 (TU/e)
- European Microwave Integrated Circuits (EUMIC) Sept 18 & 19, 2023 (Chalmers)
- International Symposium and Exhibition on Electromagnetic Compatibility (EMC Europe) Sept 4 – 8, 2023 (TU/e)
- IEEE International Microwave Symposium Jun 11 to 16, 2023 (Infineon)
- MunEDA Users Group Meeting (MUGM) May 16 & 17, 2023 (Infineon / MunEDA / IMST / Fraunhofer IIS/EAS / Fraunhofer ENAS)
- PENTA INNOSTAR – M12 – PENTA-Review – Gothenburg Jan 31 & Feb 01, 2023 (All Partners)
- 2022